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HDMI Switch ICs
2 for input 1 output switch with Termination sense correspondence (Sync with HPD_SINK)
BU16006KV
No.09063EDT01
Description BU16006KV is 2 input 1 output HDMI/DVI switch LSI. Each Port supports 2.25Gbps. (HDMI 1.3a). This device control is simple. It requires only 3.3V and a few GPIO controls. Terminated resistors(50) are integrated at each input port. When channel is not selected, termination resistors are disconnected. TMDS inputs are high impedance. This device is integrated equalization function and DDC buffer function, so it can adapt long cable.
Features 1) Supports 2.25 Gbps signaling rate for 480i/p, 720i/p, and 1080i/p resolution to 12-bit color depth 2) Compatible with HDMI 1.3a 3) 5V tolerance to all DDC and HPD_SINK inputs 4) Integrated DDC buffer 5) Integrated switchable 50receiver termination 6) Integrated equalizer circuit to adapt long cable 7) HBM ESD protection exceeds 10kV 8) 3.3V fixed supply to TMDS I/Os 9) 64Pin VQFP package 10) ROHS compatible
Applications Digital TV, DVD Player, Set-Top-Box, Audio Video Receiver, Digital Projector, DVI or HDMI Switch Box
Line up matrix
Part No. BU16020KV BU16018KV BU16027KV BU16006KV BU16024KV Power Supply (V) 3 to 3.6 3 to 3.6 3 to 3.6 3 to 3.6 3 to 3.6 ESD (KV) 10 10 10 10 10 Input (ch) HDMI 4ch HDMI 3ch HDMI 3ch HDMI 2ch HDMI 1ch Output (ch) HDMI 1ch HDMI 1ch HDMI 1ch HDMI 1ch HDMI 1ch Data rate (Gbps) 2.7 2.25 2.25 2.25 2.25 Hot Plug Control Yes Yes Yes Yes Yes Termination Sense Correspondence Yes Yes Yes Yes Yes Switching Method GPIO/I C GPIO GPIO GPIO 2
DDC Buffer Yes Yes Yes Yes Yes
Equalizer Yes (adaptive) Yes Yes Yes Yes
De emphasis Yes Yes Yes (Always ON) Yes (Always ON) Yes
Package VQFP100 VQFP80 VQFP64 VQFP64 VQFP48C
RoHS Yes Yes Yes Yes Yes
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2009.05 - Rev.D
BU16006KV
OUTSIDE DIMENSION CHART
Technical Note
BU16006KV
1 PIN MARK
Lot No.
Figure 1-1 Outside dimension chart
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2009.05 - Rev.D
BU16006KV
BLOCK DIAGRAM
Technical Note
Figure 2-1 Block Diagram
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2009.05 - Rev.D
BU16006KV
PIN EXPLANATION 1). PIN ASSIGNMENT (TOP VIEW)
Technical Note
Figure 3-1 Pin Location
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2009.05 - Rev.D
BU16006KV
2). PIN LIST TERMINAL NAME A11, A12, A13, A14 A21, A22, A23, A24 B11, B12, B13, B14 B21, B22, B23, B24 GND 43, 58 HPD1 HPD2 HPD_SINK Reserve1 Reserve2 SCL1 SCL2 SCL_SINK SDA1 SDA2 SDA_SINK S1, S2 VCC 40, 46, 55, 61 TMDS compliant voltage swing control VSADJ Y1, Y2, Y3, Y4 Z1, Z2, Z3, Z4 16 26, 23, 20, 17 27, 24, 21, 18 I (via 4.64k to GND) O O Sink port TMDS positive outputs Sink port TMDS negative outputs 35 50 31 34 49 37 52 29 36 51 30 32, 33 6, 12, 19, 25, O O I I/O I/O I/O I/O I/O I/O I/O I/O I No. I/O I I I I DESCRIPTION Source port 1 TMDS positive inputs Source port 2 TMDS positive inputs Source port 1 TMDS negative inputs Source port 2 TMDS negative inputs Ground
Technical Note
39, 42, 45, 48 54, 57, 60, 63 38, 41, 44, 47 53, 56, 59, 62 3, 9, 15, 22, 28,
Source port 1 hot plug detector output (status pin) Source port 2 hot plug detector output (status pin) Sink port hot plug detector input (status pin) Set to HIGH/LOW/OPEN Non Connect Pin Source port 1 DDC I2C clock line Source port 2 DDC I2C clock line Sink port DDC I2C clock line Source port 1 DDC I2C data line Source port 2 DDC I2C data line Sink port DDC I2C data line Source selector Power supply
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5/18
2009.05 - Rev.D
BU16006KV
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
Technical Note
TMDS Input Stage VDD
TMDS Output Stage VDD VDD
HPD Output Stage VDD Ym Zm HPDn
50
50
Anm
Bnm
10mA
R-Side I2 C Input/Output Stage VDD SCL_SINK SDA_SINK SCL SDA
T-Side I2 C Input/Output Stage VDD
HPD_SINK
VDD
n=1,2 m=1,2,3,4
Figure 4-1 I/O pin schematic diagram
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6/18
2009.05 - Rev.D
BU16006KV
Technical Note
SOURCE SELECTION LOOKUP TABLE CONTROL PINS I/O SELECTED HPD_SINK H S1 H S2 H Y/Z A1/B1 Terminations of A2/B2 and A3/B3 are disconnected A2/B2 Terminations of A1/B1 and A3/B3 are disconnected Disallowed (indeterminate)State All terminations are disconnected None (Z) All terminations are disconnected Disallowed (indeterminate)State All terminations are disconnected Disallowed (indeterminate)State All terminations are disconnected Disallowed (indeterminate)State All terminations are disconnected None (Z) All terminations are disconnected
HOT PLUG DETECT STATUS SCL_SINK HPD1 HPD2 SDA_SINK SCL1 SDA1 SCL2 SDA2 H L
HPD3 L
H
L
H
L
H
L
H
L
L
H
H
L
None (Z) Are pulled HIGH by external pull-up termination
L
L
H
H
H
H
L
H
H
SCL1 SDA1 SCL2 SDA2
L
L
L
L
L
H
L
L
L
L
L
L
L
H
L
None (Z) Are pulled HIGH by external pull-up termination
L
L
L
L
L
L
BU16006_Icc
Condition S1=Vcc,S1GND or S1=GND,S2=GND,HPD_SINK=GND,Ta=Room_temp
BU16006_Icc
(1)H: Logic high; L: Logic low; X: Don't care; Z: High impedance Icc increase about 6mA if HPD_SINK=Vcc. Figure 4-2 Supply voltage(Vcc) vs. Supply current(Icc) [S1=H,S2=L]
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7/18
2009.05 - Rev.D
BU16006KV
Technical Note
Electrical characteristics 1. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) ITEM MIN. TYP. MAX. Power supply voltage (Vcc) -0.3 4.0 DDC, HPD_SINK input voltage -0.3 6.0 Differential input voltage 2.5 4.0 S1, S2 input voltage -0.3 4.0 Power dissipation 1250 Strage temperture range -55 125 70mmx70mmx1.6mm glass epoxy board mount.Reverse Cu occupation rate15mmx15mm When it's used by than Ta=25, it's reduced by 12.5mW/. UNIT V V V V mW
2. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER VCC Supply voltage TA Operating free-air temperature TMDS DIFFERENTIAL PINS VIC Input common mode voltage VID Receiver peak-to-peak differential input voltage RVSADJ Resistor for TMDS compliant voltage swing range AVCC TMDS Output termination voltage, see Figure 5-1. RT Termination resistance, see Figure 5-1. Signaling rate CONTROL PINS (S1,S2) VIH LVTTL High-level input voltage VIL LVTTL Low-level input voltage STATUS(HPD_SINK) VIH LVTTL High-level input voltage VIL LVTTL Low-level input voltage DDC PINS (SCL_SINK, SDA_SINK,SDA[2:1],SCL[2:1]) VI(DDC) Input voltage
MIN. 3 0 VCC-0.6 150 4.60 3 45 0 2 GND 2.4 GND GND
TYP. 3.3 4.64 3.3 50 -
MAX. 3.6 70 VCC+0.01 1560 4.68 3.6 55 2.25 VCC 0.8 5.5 0.8 5.5
UNIT V V mVp-p k V Gbps V V V V V
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8/18
2009.05 - Rev.D
BU16006KV
3. ELECTRICAL CHARACTERISTICS Over recommended operating conditions (unless otherwise noted) LIMITS
SYMBOL
Technical Note
PARAMETER
TEST CONDITIONS
MIN.
TYP.(1)
MAX.
UNIT
Icc
Supply current
PD
Power dissipation
VIH- = Vcc,VIL = Vcc-0.4V,RVSADJ = 4.64k RT = 50,AVcc = 3.3V Am/Bm = 2.25 Gbps HDMI data pattern, m = 2,3,4 A1,/B1 = 225 MHz clock VIH = Vcc,VIL = Vcc-0.4V,RVSADJ = 4.64k RT = 50,AVcc = 3.3V Am/Bm = 2.25Gbps HDMI data pattern, m = 2,3,4 A1/B1 =255 MHZ clock
-
120
150
mA
-
450
600
mW
TMDS DIFFERENTIAL PINS (A/B;Y/Z) Single-ended high-level output VOH voltage Single-ended low-level output VOL voltage Single-ended low-level swing VSWING voltage Overshoot of output differential Vod(O) voltage Undershoot of output Vod(U) differential voltage
Avcc -200 Avcc -600 See Figure 5-2, AVcc = 3.3V, RT = 50 300 See Figure 5-2, Am/Bm = 250 Mbps HDMI data pattern , m = 2,3,4 A1/B1 = 25 MHz clock VIN = 2.9V
6% 12%
Avcc-50 Avcc-400 460 15% 25%
mV mV mV 2xVswing 2xVswing
VOD()
Steady state output dierential voltage
600
-
920
mVp-p
RINT VOCSS
Input termination resistance Change in steady-state common-mode output voltage between logic states
45 -
50 5
55 -
mV
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9/18
2009.05 - Rev.D
BU16006KV
Technical Note
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN.
TYP.(1)
MAX.
UNIT
VIH VIL IlKT IlKT IOHT IILT VOLT VOLT-VIL
DDC Input and output Tx High-level input voltage Low-level input voltage Input leak current, VI=5.5V Input leak current, VI=Vcc High-level output current VO=3.6V Low-level input current VIL=GND Low-level output voltage RL=4.7k Low-level input voltage below output low-level voltage
2.1 -0.3 -10 -10 -10 -10 0.43 20
0.5 100
5.5 0.35 10 10 10 10 0.57 190
V V uA uA uA uA V mV
VIH VIL IlKR IlKR IOHR IILR VOLR
High_level input voltage Low-level input voltage Input leak current Input leak current High-level output current Low-level input current Low-level output voltage (HPD 1, HPD 2,) IOH = -8mA IOL = 8mA VI=5.5V VI=Vcc VO=3.6V VIL=GND Iout = 4mA
2.4 -0.3 -10 -10 -10 -10 -
-
5.5 0.8 10 10 10 10 0.2
V V uA uA uA uA V
STATUS PINS VOH(TTL) VOL(TTL)
TTL High -level output voltage TTL Low -level output voltage (S1, S2 )
2.4 0
-
Vcc 0.4
V V
CONTROL PINS IIH IIL
High -level digital input current Low -level digital input current
VIH = Vcc VIL = GND
-10 -10
-
10 10
uA uA
STATUS PINS (HPD_SINK) VIH = 5.5V IIH IIL High -level digital input current VIH = Vcc Low -level digital input current VIL = GND 5 -10 30 80 10 uA uA 10 50 100 uA
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10/18
2009.05 - Rev.D
BU16006KV
SYMBOL
Technical Note
PARAMETER TEST CONDITIONS LIMITS MIN. TYP.(1) MAX. UNIT
TMDS DIFFERENTIAL PINS (Y/Z) Propagation delay time 480 ps tPLH low-high-level output Propagation delay time tPHL 500 ps low-high-level output Differential output signal rise tr 150 ps time (20%-80%) Differential output signal fall See Figure 5-2, AVCC = 3.3V, tf 150 ps time (20%-80%) RT = 50 tsk(p) Pulse skew (|tPHL - tPLH |) 20 ps Intra-pair differential skew, see tsk(D) 50 ps Figure 5-3. Inter-pair channel-to-channel tsk(o) 50 ps output skew(2) tsk(pp) Part to part skew(3) 400 ps DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK) Propagation delay time, tpdLHTR(DDC) low-to-high-level output 650 ns Tx to Rx RL = 4.7K,CL = 100pF Propagation delay time, tpdHLTR(DDC) 200 ns high-to-low-level output Tx to Rx Propagation delay time, tpdLHRT(DDC) 500 ns low-to-high-level output Rx to Tx RL = 1.67K,CL = 400pF Propagation delay time, tpdHLRT(DDC) high-to-low-level output 350 ns Rx to Tx tr Tx(DDC) Tx output Rise time 800 ns RL = 4.7K,CL = 100pF tf Tx(DDC) Tx output Fall time 150 ns tr Rx(DDC) Rx output Rise time 950 ns RL = 1.67K,CL = 400pF tf Rx(DDC) Rx output Fall time 50 ns tsx Select to switch output 8 ns tdis Disable time 5 ns ten Enable time 7 ns Switch time from SCLn to tsx(DDC) CL=10pF 800 ns SCL_SINK CIO Input/output capacitance VI=0V 15 pF STATUS PINS(HPD1,HPD2,HPD3) Propagation delay time, tpdLH(HPD) low-to-high-level output from CL=10pF 5 ns HPD_SINK to HPDn(n=1,2) Propagation delay time, tpdHL(HPD) high-to-low-level output from CL=10pF 5 ns HPD_SINK to HPDn(n=1,2) Switch time from port select to tsx(HPD) CL=10pF 8 ns the latest valid status of HPD Note: 1. All typical values are at 25 and with a 3.3V supply. 2. tsk(o) is the magnitude of the difference in propagation delay times between any specified terminals of channel of a devices when inputs are tied together. 3. tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of channel of two devices, or between channel 1 of two devices, when both devices operate with the same source, the same supply voltages, at the same temperature, and have identical packages and test circuits.
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11/18
2009.05 - Rev.D
BU16006KV
Technical Note
MEASUREMENT SYMBOL AND CIRCUIT
AVCC RT Zo = RT
TMDS Driver
RT
TMDS Receiver
Zo = RT
Figure 5-1 Termination for TMDS Output Driver
Vcc RINT RINT Y
TMDS Driver TMDS Receiver
RT VY VZ RT AVCC
VA
A VID B VB
CL 0.5pF Z
VID = VA - VB
Vswing = VY - VZ
DC Coupled VA VB VID VID(pp) VIC Vcc V Vcc-0.4 V 0.4 V 0V -0.4 V tPLH Vswing VOD(pp) tf VOC 80% VOD(O) 20% tr VOD(U) VOC(SS) tPLH 100%
AC Coupled Vcc+0.2 V Vcc-0.2 V
0V Differential 0%
Figure 5-2. Timing Test Circuit and Definitions
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12/18
2009.05 - Rev.D
BU16006KV
Technical Note
VY VZ
VOH 50%
tsk(D)
VOL
Figure 5-3 Definition of Intra-Pair Differential Skew
A Port 1 B A Port 2 B S1 Clocking S2
Vcc V Vcc-0.4 V Vcc-0.4 V Vcc V VDD 2 VDD 0V
tsx
Y Output Z
tsx
75mV -75mV HI-Z 75mV -75mV
tdis
Figure 5-4 TMDS Outputs Control Timing Definitions
ten
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13/18
2009.05 - Rev.D
BU16006KV
Technical Note
VDD 2
HPD_SINK
VDD 2
HPD1 tpdHL(HPD) HPD2 HPD3 S1 S2 SDA_SINK SDA1
1.5V
tpdLH(HPD)
tsx(HPD)
2.4V
0V Vcc 2
tpdHLRT(DDC) tpdLHRT(DDC)
80% 20% 1.5V
tpdHLTR(DDC)
tpdLHTR(DDC)
tSX(DDC)
VDD
V IL 80% 20% 0V
SDA2 SDA3 tfTX(DDC) trTX(DDC) tfRX(DDC) TX to RX trRX(DDC) RX to TX
VDD
Figure 5-5 DDC and HPD Timing Definitions
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14/18
2009.05 - Rev.D
BU16006KV
1). HPD_SINK Pull down resistance. HPD_SINK is a 5V tolerant structure shown in Figure 6-1. It needs some drive current to pull down HPD_SINK "H" to "L"(max10uA@HPD_SINK=2V). So to pull down HPD_SINK, please use 10k(or under 10k) resistor.
Technical Note
Figure 6-1 HPD SINK I/O schematic
2). About don't use terminal. Unused TMDS input channel can be opened.
B U 1 6 0 * * KV
Vcc R INT R INT RT A TMDS Receiver TMDS Driver Y AVcc
B
Z
RT
Figure 6-2 TMDS Input Fail-Safe Recommendation
Unused DDC Buffers of R side polled up to V.
VCC 4.7k SCL SDA R
Figure 6-3 DDC Buffers in BU160**KV
T SCL_SINK SDA_SINK
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15/18
2009.05 - Rev.D
BU16006KV
Open unused HPDn.
Technical Note
Figure 6-4 Open unused HPDn
3. About serial connect notice. When HDMI sw output connect to other HDMI sw input like following application. There is possibility that. 1080p(12bit) image isn't displayed. It's depend on receiver IC characteristic. When system is required 1080p (12bit), Rohm doesn't recommend serial connect application.
Vcc RINT RINT RINT
Vcc RINT RT
A
TMDS Receiver
TMDS Driver
Y
A
TMDS Receiver
TMDS Driver
Y Z
AVCC
B
Z
B
RT
Figure 6-5 serial connect notice
4. Offset voltage appearance. If differential input is opened, offset voltage appear at differential output OE is set to low to avoid it.
Figure 6-6 Offset voltage avoid
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16/18
2009.05 - Rev.D
BU16006KV
5. Limitation of Master and slave direction.
Technical Note
Figure 6-7 Limitation of Master and slave direction
6). Attention in use as repeater.
Figure 6-8 Ioff specification not meet to HDMI CTS
Depend on HDMI CTS, Voff must be less than VDD-10mV, but this IC not meet to CTS cause of Ioff.
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17/18
2009.05 - Rev.D
BU16006KV
Ordering part number
Technical Note
B U1 6 0 06
ROHM model name
KV
Package type VQFP64
E2
Packaging and forming specification E2 =Reel-shaped emboss taping
Package specification
VQFP64
12.00.2 10.00.1
48 49 33 32

Tape Quantity Direction of feed Embossed carrier tape (with dry pack) 1000pcs E2
direction the at left when you ( The on the leftishand1pin of product is thethe upperthe right hand hold ) reel and you pull out tape on
12.00.2
10.00.1
0.50.15
64 1 16
17
1.25
1.6MAX
1PIN MARK
+0.05 0.145 -0.03
4 +6 -4
1.40.05 0.10.05
0.08 S +0.05 0.2 -0.04 0.50.1 0.08
M
1.00.2
1.25
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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18/18
2009.05 - Rev.D
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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